¡´ Product Name

Product No.

Classification

Composition

Melting Point(¢J)

Soldering Temp(¢J)

Features

3C05

Sn-Ag system

Sn3Ag0.5Cu

217/217

235±5

- High reliability

- Excellent corrosion resistance and   spreadability

- Minimum Void

5A35

Sn3.5(3)Ag0.5Cu 0.06Ni0.01Ge

217/217

4B20

Sn-Ag System

(Adding Bi,In)

Sn0.7Cu (α)

215/216

230±5

- Excellent spreadability and bondability

- Possible to apply Phenol substrate

4I20

Sn0.5Cu0.06Ni (α)

195/204

3B30

Sn-Zn System

Sn8Zn3Bi

191/191

220 and less

- Possible to joining in low temperature

- Lack of corrosion resistance and   spreadability

2B58

Sn-Bi System

Sn58Bi(1Ag)

139/139

220 and less

- Possible to joining in low temperature

- Low cost

2S50

Sn-Sb System

Sn5Sb

232/240

265±5

- Possible to joining in high temperature

Classification

Product No.

Alloy Composition

Melting Point(¢J)

Features

Powder Granularity

EF Solder

EFD-2S50

Sn5Sb

232/240

- Good continuous printability

- Excellent preservation property

- Minimum change of viscosity for   aging time

- Countermeasure for high   temperature

20-32?

20-38?

20-45?

20-53?

EFD-2A35

Sn3.5Ag

221/221

EFD-3C05

Sn3Ag0.5Cu

217/217

EFD-5A35

Sn3.5Ag0.5Cu(Ni, Ge)

217/217

EFD-2B58

Sn58Bi

139/139

Micro Solder

MD-2P37

Sn37Pb

183