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Pb Free EF Solder Bar
EFB-Series
Pb Free EF Solder Bar
Characteristic
  • Minimal Shrinkage on fillet
  • Minimal Dross generation
  • Minimal Erosion
  • Excellent wettability and Spreadability
  • Superior joining Reliability

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Solder Bar for Wave

 

Product No.

Classification

Composition

Melting Point (¢J)

Soldering Temp(¢J)

Features

2C07

Sn-Cu?

Sn0.7Cu (α)

227/227

260±5

- Minimal Dross

- Minimal Pad Erosion

- High Reliability

3N06

Sn0.5Cu0.06Ni (α)

220/233

2N06

Sn0.06Ni (α)

230/233

4A03

Sn0.7Cu0.3Ag (α)

221/227

2S50

Sn-Sb?

Sn5Sb

232/240

270±5

3C05

Sn-Ag?

Sn3Ag0.5Cu

217/217

255±5

- High Reliability

- Minimal Dross

- Excellent erosion resistance   and spreadability

5A35

Sn3.5(3)Ag0.5Cu (Ni, Ge)

217/217

 

High Temperature Solder Bar for Dipping

 

Product No.

Classification

Melting Point

Soldering Temp(¢J)

Features

3C30

Sn3Cu (α)

227/312

350±10

 - Minimal dross generation

 - Minimal Oxidant

 - Minimal Pad Erosion

 - Excellent Joinability

3C40

Sn4Cu (α)

227/353

390±10

4C40

Sn4Cu0.05Ni (α)

227/353

390±10

 

Antioxidant for Pb Free

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Product No.

Composition

Soldering Temp(¢J)

Use

Antiox α

Sn-Cu system

260±5

Antioxidant for wave

Antiox ß

Sn-Ag system

255±5

Antiox γ

Sn-Cu System

350~550

Antioxidant for dip

 


 

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